Stress evolution and whisker growth during thermal cycling...

Acta Materialia 2017 / 05 Vol. 129

Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments

Pei, Fei, Buchovecky, Eric, Bower, Allan, Chason, Eric
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Volume:
129
Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2017.03.005
Date:
May, 2017
File:
PDF, 3.84 MB
english, 2017
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