An Accurate and Fast Substrate Noise Prediction Method With Octagonal TSV Model for 3-D ICs
Hsu, Yi-An, Cheng, Chi-Hsuan, Lu, Yi-Chang, Wu, Tzong-LinYear:
2017
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/temc.2017.2665666
File:
PDF, 1.77 MB
english, 2017