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Modeling Complex Inelastic Deformation Processes in IC Packages’ Solder Joints
Busso, E. P., Kitano, M., Kumazawa, T.Volume:
116
Year:
1994
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905496
File:
PDF, 2.72 MB
english, 1994