Effect of nano-Cu addition on microstructure evolution of...

Soldering & Surface Mount Technology 2017 / 04 Vol. 29; Iss. 2

Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Ban, Gaofang, Sun, Fenglian, Liu, Yang, Cong, Shaonan
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Volume:
29
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-06-2016-0013
Date:
April, 2017
File:
PDF, 743 KB
english, 2017
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