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[IEEE 2017 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2017.2.5-2017.2.9)] 2017 IEEE International Solid-State Circuits Conference (ISSCC) - 9.3 A BJT-based temperature sensor with a packaging-robust inaccuracy of ±0.3°C (3σ) from −55°C to +125°C after heater-assisted voltage calibration
Yousefzadeh, Bahman, Makinwa, Kofi A. A.Year:
2017
Language:
english
DOI:
10.1109/ISSCC.2017.7870311
File:
PDF, 9.86 MB
english, 2017