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[IEEE 2016 International Conference on Microelectronics, Computing and Communications (MicroCom) - Durgapur, India (2016.1.23-2016.1.25)] 2016 International Conference on Microelectronics, Computing and Communications (MicroCom) - Effect of filling dielectric in etched trenches of novel unipolar nanodiode
Garg, S., Garg, A., Bansal, S., Chaudhary, A., Singh, A. K., Kasjoo, S. R.Year:
2016
Language:
english
DOI:
10.1109/microcom.2016.7522531
File:
PDF, 971 KB
english, 2016