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Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels
Schultz, Mark, Yang, Fanghao, Colgan, Evan, Polastre, Robert, Dang, Bing, Tsang, Cornelia, Gaynes, Michael, Parida, Pritish, Knickerbocker, John, Chainer, TimothyVolume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4033309
Date:
April, 2016
File:
PDF, 2.37 MB
english, 2016