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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI, USA (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - IBIS-AMI modelling of high-speed memory interfaces
Yan, John, Zargaran-Yazd, ArashYear:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7874411
File:
PDF, 1.22 MB
english, 2016