[IEEE 2016 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Honolulu, HI, USA (2016.12.14-2016.12.16)] 2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) - Signal integrity for USB 3.1 Gen 2 front end challenging loss budget

El Sabbagh, Mahmoud A.
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Year:
2016
Language:
english
DOI:
10.1109/EDAPS.2016.7874419
File:
PDF, 691 KB
english, 2016
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