[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - In-Bi low-temperature SLID bonding
Aasmundtveit, Knut E., Thi Ai Vy Nguyen,, Nguyen, Hoang-VuYear:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764687
File:
PDF, 17.28 MB
english, 2016