Electrothermal Evaluation of Single and Multiple Solder...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 3 Vol. 7; Iss. 3

Electrothermal Evaluation of Single and Multiple Solder Void Effects on Low-Voltage Si MOSFET Behavior in Forward Bias Conditions

Tran, Son Ha, Dupont, Laurent, Khatir, Zoubir
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2633582
Date:
March, 2017
File:
PDF, 2.76 MB
english, 2017
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