![](/img/cover-not-exists.png)
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
Sujan, D., Woldemichael, Dereje E., Murthy, M. V. V., Seetharamu, K. N.Volume:
133
Year:
2011
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4005294
File:
PDF, 734 KB
english, 2011