Investigations of mutual thermal coupling between SiC...

Circuit World 2017 / 02 Vol. 43; Iss. 1

Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case

Górecki, Krzysztof, Bisewski, Damian, Zarębski, Janusz, Kisiel, Ryszard, Myśliwiec, Marcin
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Volume:
43
Language:
english
Journal:
Circuit World
DOI:
10.1108/CW-10-2016-0046
Date:
February, 2017
File:
PDF, 376 KB
english, 2017
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