Modeling and Optimization of Multiground TSVs for Signals...

IEEE Transactions on Electromagnetic Compatibility 2017 / 4 Vol. 59; Iss. 2

Modeling and Optimization of Multiground TSVs for Signals Shield in 3-D ICs

Qu, Chenbing, Ding, Ruixue, Liu, Xiaoxian, Zhu, Zhangming
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Volume:
59
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/temc.2016.2608981
Date:
April, 2017
File:
PDF, 944 KB
english, 2017
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