Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics
Jeng, Yeau-Ren, Lin, Jeng-NanVolume:
125
Year:
2003
Language:
english
Journal:
Journal of Tribology
DOI:
10.1115/1.1537265
File:
PDF, 494 KB
english, 2003