IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences
2016 Vol. E99.A; Iss. 6
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Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads
LAI, Yung-Hao, CHANG, Yang-Lang, FANG, Jyh-Perng, CHANG, Lena, KOBAYASHI, HirokazuVolume:
E99.A
Year:
2016
Language:
english
Journal:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences
DOI:
10.1587/transfun.e99.a.1206
File:
PDF, 2.85 MB
english, 2016