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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking
Inoue, Fumihiro, Jourdain, Anne, Vos, Joeri De, Sleeckx, Erik, Beyne, Eric, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Hopkins, Janet, Thomas, Dave, Uedono, AkiraYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.102
File:
PDF, 1.70 MB
english, 2016