[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Impact of 3D Via Middle TSV Process on 20nm Wafer Level FEOL and BEOL Reliability
S., Premachandran C., England, Luke, Kannan, Sukeshwar, Ranjan, Rakesh, Yeap, Kong Boon, Teo, Walter, Cimino, Salvatore, Jing, Tan, Zhang, Haojun, Smith, Daniel, Justison, Patrick, Parameshwaran, BijuYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.254
File:
PDF, 1.62 MB
english, 2016