[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development and Reliability Evaluation of Large Scale Thin TSV Die Stacking on Wafer
Bum, Lee Jong, Choong, Chong Ser, Yuen, Au Keng, Woo, Rhee MinYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.316
File:
PDF, 1.37 MB
english, 2016