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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Improvement of a TSV Reveal Process Comprising Direct Si/Cu Grinding and Residual Metal Removal
Watanabe, Naoya, Aoyagi, Masahiro, Bandoh, Tsubasa, Mitsui, Takahiko, Yamamoto, EiichiYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.381
File:
PDF, 2.65 MB
english, 2016