[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of Non-TSV Interposer (NTI) for High Electrical Performance Package
Liang, Fang-Yu, Chang, Hung-Hsien, Tseng, Wen-Tsung, Lai, J. Y., Cheng, Stephen, Ma, Mike, Ramalingam, Suresh, Wu, Xin, Gandhi, JaspreetYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.83
File:
PDF, 1.56 MB
english, 2016