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[ASME ASME 2005 International Mechanical Engineering Congress and Exposition - Orlando, Florida, USA (November 5 – 11, 2005)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Stress Analysis of a Novel MEMS Microphone Chip Using Finite Element Analysis
Gao, Jia, Miles, Ronald N., Cui, WeiliVolume:
2005
Year:
2005
Language:
english
DOI:
10.1115/IMECE2005-82823
File:
PDF, 1.39 MB
english, 2005