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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
Reddy, Sohail R., Abdoli, Abas, Dulikravich, George S., Pacheco, Cesar C., Vasquez, Genesis, Jha, Rajesh, Colaco, Marcelo J., Orlande, Helcio R. B.Year:
2015
Language:
english
DOI:
10.1115/IPACK2015-48242
File:
PDF, 3.67 MB
english, 2015