Fatigue life prediction of Package-on-Package stacking...

Microelectronics Reliability 2017 / 04 Vol. 71

Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading

Xia, Jiang, Li, GuoYuan, Li, Bin, Cheng, LanXian, Zhou, Bin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
71
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.03.005
Date:
April, 2017
File:
PDF, 2.63 MB
english, 2017
Conversion to is in progress
Conversion to is failed