Polarized evolution of interfacial intermetallic compounds...

Journal of Materials Science: Materials in Electronics 2017 / 6 Vol. 28; Iss. 12

Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

Zhu, Ze, Li, Yi, Chan, Yan Cheong, Wu, Fengshun
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Volume:
28
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-6596-0
Date:
June, 2017
File:
PDF, 1.80 MB
english, 2017
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