[IEEE 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) - Sendai, Japan (2016.4.17-2016.4.20)] 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) - Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps

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