[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Thermal Modeling of Memory Access Operations in Microprocessors
Raj, Ratnesh, Sarkar, Daipayan, Jain, AnkurYear:
2016
Language:
english
DOI:
10.1115/IMECE2016-67697
File:
PDF, 1.92 MB
english, 2016