Embedded Trench Redistribution Layers at 2-5 μm Width and...

  • Main
  • 2017
  • Embedded Trench Redistribution Layers at 2-5 μm Width and...

Embedded Trench Redistribution Layers at 2-5 μm Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20-40 μm I/O Pitch Interposers

Suzuki, Yuya, Hichri, Habib, Wei, Frank, Sundaram, Venky, Tummala, Rao
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2676023
File:
PDF, 2.29 MB
english, 2017
Conversion to is in progress
Conversion to is failed