Embedded Trench Redistribution Layers at 2-5 μm Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20-40 μm I/O Pitch Interposers
Suzuki, Yuya, Hichri, Habib, Wei, Frank, Sundaram, Venky, Tummala, RaoYear:
2017
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2017.2676023
File:
PDF, 2.29 MB
english, 2017