Electromagnetic Characteristics of Multiport TSVs Using...

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IEEE Transactions on Electromagnetic Compatibility 2017

Electromagnetic Characteristics of Multiport TSVs Using L-2L De-Embedding Method and Shielding TSVs

Li, Yong-Sheng, Li, Yan, Min, Qiu, Wu, Ke, Liu, En-Xiao, Hao, Ran, Chen, Hong-Sheng, Zhuo, Cheng, Yin, Wen-Yan, Wang, Zhe-Yao, Yu, Hui-Chun, Li, Er-Ping
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Electromagnetic Compatibility
DOI:
10.1109/TEMC.2017.2664047
File:
PDF, 1.42 MB
english, 2017
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