[IEEE 2016 IEEE 66th Electronic Components and Technology...

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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages

Kim, Min Suk, Pulugurtha, Markondeya Raj, Wu, Zihan, Sundaram, Venky, Tummala, Rao
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Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.287
File:
PDF, 539 KB
english, 2016
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