Depressing of Cu Cu bonding temperature by composting Cu...

Journal of Alloys and Compounds 2017 / 06 Vol. 709

Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles

Li, Junjie, Yu, Xing, Shi, Tielin, Cheng, Chaoliang, Fan, Jinhu, Cheng, Siyi, Li, Tianxiang, Liao, Guanglan, Tang, Zirong
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Volume:
709
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2017.03.220
Date:
June, 2017
File:
PDF, 1.05 MB
english, 2017
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