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Nanoparticle/solder hybrid joints for next-generation power semiconductor modules
Satoh, Toshikazu, Ishizaki, Toshitaka, Usui, MasanoriVolume:
124
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2017.03.061
Date:
June, 2017
File:
PDF, 1.51 MB
english, 2017