Study of a silicon/glass bonded structure with a UV-curable...

Microelectronic Engineering 2017 / 04 Vol. 173

Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

Montméat, P., Enot, T., De Marco Dutra, M., Pellat, M., Fournel, F.
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Volume:
173
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.03.008
Date:
April, 2017
File:
PDF, 1.07 MB
english, 2017
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