Application of I-structure though-glass interconnect filled with submicron gold particles to a hermetic sealing device
Nomura, Kazuya, Okada, Akiko, Shoji, Shuichi, Ogashiwa, Toshinori, Mizuno, JunVolume:
26
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/26/10/105018
Date:
October, 2016
File:
PDF, 1.43 MB
english, 2016