FEM thermal analysis of Cu/diamond/Cu and diamond/SiC heat spreaders
Denu, Garuma Abdisa, Mirani, Jibran Hussain, Fu, Jiao, Liu, Zongchen, Wang, HongxingVolume:
7
Language:
english
Journal:
AIP Advances
DOI:
10.1063/1.4978043
Date:
March, 2017
File:
PDF, 1.75 MB
english, 2017