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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays - 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Zhang, Xuchen, Han, Xuefei, Sarvey, Thomas E., Green, Craig E., Kottke, Peter A., Fedorov, Andrei G., Joshi, Yogendra, Bakir, Muhannad S.Year:
2015
Language:
english
DOI:
10.1115/IPACK2015-48584
File:
PDF, 2.69 MB
english, 2015