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[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Addressing the sample preparation challenges in failure analysis of wafer level chip scale package mounted inside a customer camera module
Lagar, Jason H., Sia, Rudolf A.Year:
2016
DOI:
10.1109/ipfa.2016.7564264
File:
PDF, 545 KB
2016