[ASME ASME 2012 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 9 November 2012)] Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B - Encapsulating Protective Layers for Enhancing Survivability of Circuit Board Assemblies in Harsh and Extreme Environments
Chao, Nien-Hua, Dispenza, John A., DeAngelis, Mario E.Year:
2012
Language:
english
DOI:
10.1115/IMECE2012-85959
File:
PDF, 1.56 MB
english, 2012