Exploration of baking temperature effects on 28 nm BEOL...

Microelectronics Reliability 2017 / 05 Vol. 72

Exploration of baking temperature effects on 28 nm BEOL reliability

Zhao, XiangFu, Chien, Wei Ting Kary
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Volume:
72
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.03.019
Date:
May, 2017
File:
PDF, 1.78 MB
english, 2017
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