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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Internal Thermal Management of IBM P-Server Large Format Multi-Chip Modules Utilizing Small Gap Technology
Coico, Patrick A., Messina, Gaetano, Ostrander, Steven, Zitz, Jeffrey, Zou, WeiYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73422
File:
PDF, 587 KB
english, 2005