Effect of Pr addition on properties and Sn whisker growth...

Journal of Materials Science: Materials in Electronics 2017 / 7 Vol. 28; Iss. 14

Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging

Wu, Jie, Xue, Songbai, Wang, Jingwen, Wang, Jianxin, Liu, Shuang
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Volume:
28
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-6790-0
Date:
July, 2017
File:
PDF, 5.80 MB
english, 2017
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