Texture of Al films for wafer-level thermocompression...

Superlattices and Microstructures 2017 / 06 Vol. 106

Texture of Al films for wafer-level thermocompression bonding

Malik, Nishant, Venkatachalapathy, Vishnukanthan, Dall, Wilhelm, Schjølberg-Henriksen, Kari, Poppe, Erik, Visser Taklo, Maaike M., Finstad, Terje G.
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Volume:
106
Language:
english
Journal:
Superlattices and Microstructures
DOI:
10.1016/j.spmi.2017.03.053
Date:
June, 2017
File:
PDF, 10.45 MB
english, 2017
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