A Solution to Press-Pack Packaging of SiC MOSFETs
Zhu, Nan, Mantooth, H. Alan, Xu, Dehong, Chen, Min, Glover, Michael D.Year:
2017
Language:
english
Journal:
IEEE Transactions on Industrial Electronics
DOI:
10.1109/TIE.2017.2686365
File:
PDF, 10.90 MB
english, 2017