[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects
Kariya, Yoshiharu, Hosoi, Takuya, Terashima, Shinichi, Tanaka, Masamoto, Otsuka, MasahisaYear:
2003
Language:
english
DOI:
10.1115/IPACK2003-35165
File:
PDF, 555 KB
english, 2003