Large-scale anodic bonding mediated by a liquid tin solder
Claure Ramirez, Ernesto, Klemenčič, Robert, Klučka, Martin, Lang, Britta, Beisel, Samuel, Altorfer, Heinz, Koebel, Matthias M., Malfait, Wim J.Volume:
246
Language:
english
Journal:
Journal of Materials Processing Technology
DOI:
10.1016/j.jmatprotec.2017.03.006
Date:
August, 2017
File:
PDF, 2.98 MB
english, 2017