Reliability of Anisotropic Conductive Adhesive Flip Chip...

Procedia Engineering 2016 Vol. 168

Reliability of Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors in Prolonged Hygrothermal Exposure

Frisk, Laura, Lahokallio, Sanna, Mostofizadeh, Milad, Parviainen, Anniina, Kiilunen, Janne
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Volume:
168
Year:
2016
Language:
english
Journal:
Procedia Engineering
DOI:
10.1016/j.proeng.2016.11.509
File:
PDF, 266 KB
english, 2016
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