Near-interface Si substrate 3d metal contamination during...

Near-interface Si substrate 3d metal contamination during atomic layer deposition processing detected by electron spin resonance

Nguyen, A. P. D., Stesmans, A., Hiller, D., Zacharias, M.
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Volume:
111
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.4709445
Date:
June, 2012
File:
PDF, 746 KB
english, 2012
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