![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - A Novel Experimental System for Characterizing Interface Delamination under Mixed-Mode Fatigue Loading
Chiu, Tz-Cheng, Lu, Wei, Hua, Chi-An, Hsu, Chia-KueiYear:
2016
DOI:
10.1109/ectc.2016.117
File:
PDF, 581 KB
2016