Evaluation and Improvement of the Adhesive Fracture...

Journal of Electronic Packaging 2002 Vol. 124; Iss. 3

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Kamiya, Shoji, Takahashi, Hironori, Saka, Masumi, Abé, Hiroyuki
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Volume:
124
Year:
2002
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1481374
File:
PDF, 844 KB
english, 2002
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