Microcantilever Fracture Testing of Intermetallic Cu3Sn in Lead-Free Solder Interconnects
Philippi, Bastian, Matoy, Kurt, Zechner, Johannes, Kirchlechner, Christoph, Dehm, GerhardVolume:
46
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-5203-0
Date:
March, 2017
File:
PDF, 994 KB
english, 2017